From January to last month, overseas shipments of electronics equipment increased 5.7 percent year-on-year to US$3.69 billion ...

ASE Technology Holding Co (日月光投控), the world’s largest IC packaging and testing services provider, held a groundbreaking ...

TSMC will build two additional fabs in Kaohsiung, Taiwan, bringing the company’s total number of facilities in the region to ...

TSMC's Fab 21 in Arizona has not yet fully commenced its first phase of mass production, but it is already producing Apple's ...

Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build ...

Amkor Technology Inc. and Taiwan Semiconductor Manufacturing Co. (TSMC) have signed an agreement to bring advanced packaging and test capabilities to the pure play foundry’s Arizona fabs currently ...

Summary TSMC is partnering with Amkor Technology to provide advanced packaging and testing services in Arizona, addressing customer needs for geographic flexibility. This collaboration supports TSMC's ...

TSMC, Amkor to bring advanced chip packaging to U.S. for first time: Summary TSMC and Amkor have partnered to bring advanced chip packaging to the U.S., marking a milestone in Ame ...

Amkor Technology and TSMC announced the signing of a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona, further expanding the region’s semiconductor ...

Taiwan Semiconductor's robust AI-related growth supports high revenue growth and premium valuation multiples. Read why I rate ...

Apple’s chip-making partner TSMC and chip packaging company Amkor announced on Thursday that they’ve agreed in principle to ...

Amkor and TSMC on Friday said they had signed a memorandum of understanding to bring TSMC’s proven advanced packaging technologies — chip-on-wafer-on-substrate (CoWoS) and int ...